Semiconductor Assembly & Packaging Equipment Market Outlook: Driving the Next Era of Chip Innovation
The global semiconductor assembly & packaging equipment market is entering a period of strong and sustained growth. Valued at US$3.7 billion in 2024, the market is forecast to reach US$6.9 billion by 2031, registering a steady CAGR of 9%. This growth trajectory reflects the critical role of assembly and packaging equipment in enabling advancements in chip...
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