Market Overview
The 3D TSV and 2.5D Market is expected to expand from USD 5.14 billion in 2025 to USD 10.74 billion by 2034, representing a compound annual growth rate (CAGR) of 8.52% over the forecast period (2025–2034). In 2024, the market was valued at USD 4.74 billion.
The 3D Through-Silicon Via (TSV) and 2.5D market are revolutionizing the...
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