According to the UnivDatos, Rising demand for automotive electronics, increasing adoption of advanced packaging technologies, and nearshoring-driven OSAT investments would drive the Mexico Semiconductor Packaging market. As per their “Mexico Semiconductor Packaging Market” report, the market was valued at USD 724.7 Million in 2024, growing at a CAGR of about 8.7% during the forecast period from 2025 - 2033 to reach USD Million by 2033.

Momentum in the Mexican semiconductor packaging market is moving due to the rapid pace of the automotive electronics, consumer devices, and industrial automation. Semiconductor packaging that entails the process of wrapping up semiconductor components to guard them and also connect them electrically is being advanced amidst the rising demands of the packaging of compact, thermally efficient, and high-performance components. Flip chip, wafer-level packaging, and system-in-package (SiP) technologies are becoming popular and have been facilitated by the geographical positioning, talented labor force, and enhanced interconnection with the U.S.-based semiconductor supplies. A number of these companies, such as Foxconn, Pegatron, Wistron, Quanta, Compal, and Inventec, already own semiconductor manufacturing plants in northern Mexico. Tijuana and Juarez cities are the popular locations, and there are some places in Chihuahua, Nuevo Leon, and Sonora.

Access sample report (including graphs, charts, and figures): https://univdatos.com/reports/mexico-semiconductor-packaging-market?popup=report-enquiry

1.      ASE Group

ASE Technology Holding Co., Ltd., together with its subsidiaries, provides semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, Asia, Europe, and internationally. It develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; commercial complex, after-sales, and support services; manages parking lot services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. ASE Technology Holding Co., Ltd. was founded in 1984 and is based in Kaohsiung, Taiwan.

2.      Amkor Technology

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, and the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test, and drop shipment services; flip chip scale package products for smartphones, tablets, and other mobile consumer electronic devices; flip chip stacked chip scale packages that are used to stack memory digital baseband, and as applications processors in mobile devices; flip-chip ball grid array packages for various networking, storage, computing, automotive, and consumer applications; and memory products for system memory or platform data storage. The company provides wafer-level CSP packages for power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages used in power management, transceivers, radar, and specialty silicon; silicon wafer integrated fan-out technology that replaces a laminate substrate with a thinner structure; leadframe packages for electronic devices and mixed-signal applications; and substrate-based wirebond packages used to connect a die to a substrate. In addition, it offers micro-electro-mechanical systems packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. Further, the company provides wafer, package, and system level test services, as well as burn-in test and test development services. It serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

3.      ChipMOS Technologies

ChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of China, Singapore, and internationally. The company operates through five segments: Testing, Assembly, Display Panel Driver Semiconductor Assembly and Testing (LCDD), Bumping, and Others. It offers a range of back-end testing services for high density memory, mixed-signal, and display driver semiconductors; and packaging solutions, such as small outline package, thin small outline package, quad flat package, and substrate-based packages. The company also provides testing solutions for the entire spectrum of integrated circuits, including simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC (DDIC) devices. In addition, it offers bumping services, including gold bumping, metal composite bumping, ball drop, copper re-distribution layer, and copper pillar technology. Further, the company provides wafer-level chip scale packaging technology for IC chips in the form of wafer; and turnkey solutions, including wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment. Its semiconductors are used in personal computers, communications equipment, office automation, and consumer electronics. The company was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

4.      Powertech Technology Inc.

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products in Taiwan, Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. It provides chip probing and final test; IC packaging services, such as wafer level packing, flip chips, wire bond BGA, lead frame, and system in package; module assembly services; and quality management services. The company is also involved in the design, manufacturing, assembly, testing, and sale of semiconductors; metal surface treatment on semiconductor wire frame; and metal plating on semiconductor lead frame, as well as in investment and wafer probing testing activities. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

Click here to view the Report Description & TOC https://univdatos.com/reports/mexico-semiconductor-packaging-market

5.      Fujitsu

Founded Year	1935
Headquarter	Japan
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