The design of Board to Board Power Connectors is a complex process that involves a multitude of factors, with the ability to carry current being one of the most critical aspects. These connectors are engineered to facilitate the efficient transfer of electrical power between two circuit boards while ensuring reliability and safety. The current-carrying capacity of Board to Board Power Connectors is not a static figure but rather a carefully calculated value that is determined by a variety of design considerations.

To begin with, the design of the Board to Board Power Connectors starts with the selection of appropriate materials. The choice of materials is crucial as it directly affects the thermal and electrical properties of the connectors. Copper is often used for its excellent electrical conductivity, but other materials like gold or nickel may be employed for specific applications where resistance to oxidation or other environmental factors is a priority. The materials used must be able to conduct electricity with minimal resistance, ensuring that the Board to Board Power Connectors can handle the required current without overheating or failing.

Next, the design must take into account the physical dimensions of the connectors. The cross-sectional area of the contact points within the connectors plays a significant role in determining the current-carrying capacity. Larger contact areas can handle higher currents without excessive heating, which is why the design of Board to Board Power Connectors often includes a trade-off between size and current capacity. Engineers must balance the need for high current capacity with the physical constraints of the devices in which the connectors will be used.

The design of the Board to Board Power Connectors must also consider the contact resistance. This is the resistance that occurs at the interface between the two mating surfaces of the connectors. Minimizing contact resistance is essential for maintaining high current flow and reducing energy loss. Techniques such as gold plating or the use of conductive polymers can be employed to lower contact resistance and enhance the performance of the connectors.

Thermal management is another critical aspect of the design process. As current flows through the Board to Board Power Connectors, it generates heat. If this heat is not managed effectively, it can lead to a decrease in the connectors' performance and even failure. Designers must ensure that the connectors are able to dissipate heat efficiently, often through the use of heat sinks or other thermal management solutions.

Additionally, the design must account for the environmental conditions in which the Board to Board Power Connectors will be used. Exposure to dust, moisture, or other contaminants can affect the connectors' ability to carry current. Sealing mechanisms or protective coatings may be incorporated into the design to shield the connectors from these elements.

The design process for Board to Board Power Connectors also involves rigorous testing to ensure that the connectors can handle the specified currents. This includes testing for electrical endurance, which involves repeatedly connecting and disconnecting the connectors to simulate long-term use. Mechanical endurance testing is also performed to ensure that the physical integrity of the connectors is maintained over time.

In conclusion, the design of the current-carrying capacity of Board to Board Power Connectors is a multifaceted endeavor that involves material selection, contact area sizing, contact resistance minimization, thermal management, and environmental protection. Each of these factors must be carefully considered and balanced to ensure that the connectors can reliably handle the currents they are designed for, while also maintaining a high level of performance and longevity. Through meticulous engineering and testing, Board to Board Power Connectors can be designed to meet the exacting demands of modern electronic devices.

1、CKT: 2Pin

2、Current rating: 1A AC/DC

3、Voltage rating(max): 125V, AC/DC

4、Working Temperature: -25°C~+85°C,

(Including temperature rise in applying electrical current)

5、Contact resistance: value s20mΩ

After environmental testing≤30msΩ

6、Insulation resistance: 2100MΩ

7、Withstand voltage: 500VAC(rms)

8、Applicable PCB board thickness: 1.6mm to 2.0mm